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24 February 2009
Author: Giorgos Lazaridis
Semiconductor package families




Thin Micro Lead Frame Plastic Package (TMLFP)
  • 36 Lead Thin Quad Flat No-Lead Plastic Package



  • Thin Plastic Quad Flatpack Packages (TQFP)
  • 64 Lead Thin Plastic Quad Flatpack Package(TQFP)
  • 64 Lead Thin Plastic Quad Flatpack Package (LQFP)
  • 64 Lead Thin Plastic Quad Flatpack Exposed Pad Package (EPTQFP)
  • 80 Lead Thin Plastic Quad Flatpack Exposed Pad Package (EPTQFP)
  • 80 Lead Thin Plastic Quad Flatpack Package (LQFP)
  • 128 Lead Thin Plastic Quad Flatpack Packages (LQFP)
  • 128 Lead Thin Plastic Quad Flatpack Package (LQFP)
  • 144 Lead Thin Plastic Quad Flatpack Package �(LQFP)
  • 144 Lead Thin Plastic Quad Flatpack Package (LQFP)
  • 208 Lead Thin Plastic Quad Flatpack Package (LQFP)



  • Thin Plastic Quad Flatpack Exposed Pad Packages (EP-LQFP)
  • 128 Lead Thin Plastic Quad Flatpack Exposed Pad Package



  • Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP)
  • 64 Lead Thin Plastic Quad Flatpack Exposed Pad Package



  • Thin Plastic Power Quad Flatpack Packages (PQ-LQFP)
  • 144 Lead Thin Plastic Power Quad Flatpack Package




  • Single-In-Line Plastic Packages (SIP)
  • 7 Lead Plastic Single-In-Line Package Surface Mount "Gullwing" Lead Form



  • Ball Grid Array Packages (BGA)
  • 100 Plastic Ball Grid Array Package
  • 128 Plastic Ball Grid Array Package
  • 160 Plastic Ball Grid Array Package
  • 160 Plastic Ball Grid Array Package
  • 169 Plastic Ball Grid Array Package
  • 192 Plastic Ball Grid Array Package
  • 196 Plastic Ball Grid Array Package
  • 196 Plastic Ball Grid Array Package
  • 256 Plastic Ball Grid Array Package
  • 256 Plastic Ball Grid Array Package
  • 316 Plastic Ball Grid Array Package
  • 356 Plastic Ball Grid Array Package (PBGA)
  • 356 Plastic Ball Grid Array Package (HPBGA)



  • Thin, Fine Pitch, Plastic Ball Grid Array Package (TFBGA)
  • 81 Ball Thin, Fine Pitch, Plastic Ball Grid Array Package (TFBGA)
  • 81 Ball Very Thin, Fine Pitch, Plastic Ball Grid Array Package (VFBGA)



  • Wafer Level Chip Scale Package (WLCSP)
  • 2x2 Array 4 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch)
  • 3x2 Chip Scale Package
  • 3x2 Array 6 Ball Wafer Level Chip Scale Package (ISL59111 Only)
  • 3x2 Array 6 Ball Wafer Level Chip Scale Package (Intersil Standard)
  • 3x2 Array 6 Ball Wafer Level Chip Scale Package
  • 3x3 Array 9 Ball Wafer Level Chip Scale Package (For ISL59116, ISL59117 Only)
  • 3x3 Array 9 Ball Wafer Level Chip Scale Package (Intersil Standard)
  • 3x3 Array 9 Ball Wafer Level Chip Scale Package
  • 4x3 Array 10 Ball Wafer Level Chip Scale Package
  • 6x6 Array 36 Ball Wafer Level Chip Scale Package



  • ShellOP 3D Package
  • 3x3 Array 9 Bump ShellOP 3D Package (Optical)




  • Relative pages
  • The SCR (Silicon Control Rectifiers) theory
  • The TRIAC theory
  • Basic transistor circuits
  • 555 theory of operation
  • The transistor theory of operation
  • 555 timer basic circuits
  • Learn how RC Servos work
  • 4000 series IC pinouts
  • 74 Series IC Pinouts
  • Op-Amp IC Pinouts
  • Opto-isolator IC Pinouts










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